Distributed Sensor System Innovations - CPP

The objectives for this Phase II effort follow logically from the Phase I proposal and the ground work laid in Phase I. The overarching goal is to prove a radically different approach to sensor packaging which offers a quantum leap in performance, cost reduction and manufacturability improvement. Preliminary testing results from Phase I indicate that the alternative technical approach to telemetry packaging and construction is feasible. In this Phase II we propose to adapt the iPON/iPEN telemetry form factor to implement a thin-line Vector Sensor Towed Array (VSTA). Specific objectives include the development of thin-line vector sensor acoustic and non-acoustic nodes and the development, integration, and initial testing of a 1X VSTA.