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GOOFYFOOT LABS LLC
UEI: MTPCSNM9NV96
# of Employees: 2
HUBZone Owned: No
Socially and Economically Disadvantaged: Yes
Woman Owned: Yes
Award Charts
Award Listing
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EdgeNF CPU- 28-nm, rad hard, 1.7-GHz CPU
Amount: $149,884.00GoofyFoot Labs proposes the Edge-Of-Next-Flight (EdgeNF) CPU, a dual-core ARM Cortex A-53 computer processing unit (CPU) designed on a 28-nm Fully Depleted Silicon on Insulator (FDSOI) process running ...
SBIRPhase I2022Department of Defense Missile Defense Agency -
High Performance/Throughput, Low Latency and Low Power Field Programmable Gate Array (FPGA) for Software Defined Radio (SDR) and Cognitive Radio (CR)
Amount: $999,048.00FPGAs are widely used in nearly every DoD electronics system because of their processing capabilities, low NRE costs, field programmability, and time to market advantages over ASICs. However, FPGAs"gr ...
SBIRPhase II2013Department of Defense Army -
Extreme Environment, Rad Hard, High Performance, Low Power FPGA for Space Applications
Amount: $125,000.00To enable NASA's next-generation missions, there is a critical need for a reconfigurable FPGA that can withstand the wide temperatures ranges and radiation of the space environment while consumin ...
SBIRPhase I2013National Aeronautics and Space Administration -
High Performance/Throughput, Low Latency and Low Power Field Programmable Gate Array (FPGA) for Software Defined Radio (SDR) and Cognitive Radio (CR)
Amount: $99,995.00FPGAs have become one of the most popular implementation media for digital circuits on account of their low NRE costs, field programmability, and time to market advantages over ASICs. However, FPGAs& ...
SBIRPhase I2011Department of Defense Army -
Design and Fabrication Techniques for 3-Dimensional Integrated Circuits
Amount: $750,000.00The 3-D integration of systems through monolithic wafer stacking is an emerging technology that can alleviate power, delay, and area problems for digital circuits and can enable a host of new applicat ...
SBIRPhase II2010Department of Defense Defense Advanced Research Projects Agency -
Design and Fabrication Techniques for 3-Dimensional Integrated Circuits
Amount: $99,000.00The 3-D integration of systems through monolithic wafer stacking is an emerging technology that can alleviate power, delay, and area problems for digital circuits and can enable a host of new applicat ...
SBIRPhase I2009Department of Defense Defense Advanced Research Projects Agency
