PREFAB MODULAR LIQUID-COOLED MICRO DATA CENTER

"To enable the future needs of efficient computing for edge data
centers, Flexnode and its partners, the University of Maryland (UMD), Boeing, Iceotope, SHoP
Architects, and Arup, propose to develop a prefabricated modular micro data center with
unprecedented energy efficiency and power density. The proposed system leverages four key
component and system-level technology advancements: (a) a novel, experimentally proven,
manifold microchannel heat sink technology that gives about three times higher heat removal rates
at comparable pressure drops compared to the state-of-the-art technologies; (b) a chassis-based
novel hybrid immersion cooling approach; (c) a low-cost, high-performance additive
manufacturing-enabled dry cooling technology; and (d) a topology optimized container housing
the entire system. These advancements will be achieved while meeting or exceeding the required
performance, power density, cost, and sustainability metrics. The climate- and location-agnostic
system will deliver a minimum power density of 20 kW/m3 within the volume of an ISO 40
shipping container. The total power consumption by heat rejection infrastructure and ancillary
loads from the data center enclosure will not exceed 5% of the IT load. Sustainable design
parameters include zero net water consumption, zero global warming potential (GWP), and zero
ozone depletion potential (ODP) for all heat transfer fluids utilized. Deployment will be achievable
shortly after delivery, only requiring an external power source and connectivity. System reliability
will be engineered for at least 99.982% uptime. The proposed design will be cost-competitive with
current state-of-the-art economic performance, including total system payback of under five years
and a total system internal rate of return (IRR) of minimum 11%.
Reliability will be optimized by leveraging reliability system engineering expertise currently
in use in the data center, electronics manufacturing, and aerospace sectors.
The Flexnode team comprises members with track records of success at marketing
technological innovations and driving industry change, particularly in liquid cooling of electronic
components, heat transfer, and modular prefabrication. Their expertise will be applied to the
commercialization of the COOLERCHIPS modular micro data center."