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Printable Dielectric for Flexible Hybrid Electronics

Award Information
Agency: Department of Commerce
Branch: National Institute of Standards and Technology
Contract:  70NANB23H243
Agency Tracking Number: 024-FY23
Amount: $99,998.17
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 2
Solicitation Number: 2023-NIST-SBIR-01
Timeline
Solicitation Year: 2023
Award Year: 2023
Award Start Date (Proposal Award Date): 2023-10-01
Award End Date (Contract End Date): 2024-03-31
Small Business Information
1000 Innovation Road
Stony Brook, NY 11794-4601
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Daniel Slep
 Principal Partner
 (631) 848-2950
 dslep@chemcubed.com
Business Contact
 Daniel  Slep
Title: CEO, CO-Founder
Phone: (631) 848-2950
Email: dslep@chemcubed.com
Research Institution
N/A
Abstract

The goal for this Phase I research is to develop a stretchable dielectric ink that can be used for flexible applications. Printing electronics is a new and quickly growing alternative to traditionally manufactured electronics. Flexible hybrid electronics (FHE) is a novel approach to electronic circuit manufacturing that aims to combine the best of printed and conventional electronics. FHE devices include stretchable and wearable electronic devices. Although the benefits of FHEs promising, wearable electronics and un-foldable / expandable components are difficult to design because of poor compatibility between hard electronics and soft/flexible textiles. Most conducting materials suffer from hysteresis and resistance changes under strain. Both resistance and inductance change as the user moves with respect to any wiring, which results in unreliable signal fidelity. ChemCubed has successfully demonstrated the development of stretchable conductive ink, and successfully demonstrated the integration of carbon nanotubes into a dielectric ink. The proposed project will build on these successful efforts to develop a stretchable dielectric ink.

* Information listed above is at the time of submission. *

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